Adhesive bonding has found extensive application in the aircraft and defense industries where the failure of a bond in any of the critical load-bearing components, for example the rotor-blade of an helicopter, can bring about a catastrophic failure. Nondestructive evaluation of adhesively bonded structures attempt to assess the key factors of bond strength and quality. The bond strength [1] is primarily determined by the thickness of the bondline, as this greatly affects the stored energy in the bond. Three factors, if determined, provide a good measure of bond quality. They are bond thickness, contact angle of adhesive to substrate, and substrate surface-free energy.
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